ORBIS™ 3000 Platform
memsstar’s ORBIS™ 3000 platform offers automated wafer handling, process integration, and cluster capability for any combination of up to three XERIC™ or AURIX™ process modules. An ORBIS 3000 system, with advanced XERIC and/or AURIX process modules, can be easily integrated into wafer fabs. It can be supplemented in the future by additional modules as capacity, productivity, or capability needs grow.
Each memsstar process module uses a small-volume vacuum chamber capable of processing all standard substrate sizes—100mm, 125mm, 150mm, 200mm—as well as many different carrier and substrate types. Chambers are process-specific, featuring an optimized process kit for a particular process, substrate, or design, all with excellent process control. All process modules are based on memsstar’s unique technologies for advanced process control and offer faster process times; denser, more robust films; superior within-wafer uniformity; and wafer-to-wafer repeatability, leading ultimately to the highest yield.
ORBIS 3000 Key Features
- Provides high reliability in a compact footprint with industry-standard components
- Connects easily to existing cleanroom facilities
- Minimizes the need for ancillary equipment to handle non-toxic chemicals
- Features ease of maintenance, backed by memsstar’s comprehensive equipment service
