Blog Posts

Part 3: Vapour Phase Etching: A User’s Guide

Micro-Electro-Mechanical Systems (MEMS) device fabrication presents unique challenges for process engineers and their choice of equipment. This is largely due to the three-dimensional (3D) nature and electro-mechanical functioning of MEMS products. In fact, with these additional challenges, a fundamentally different …

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Part 2: Material Issues in MEMS Etching Processes

MEMS device fabrication requires a broad range of reactions and chemistries to create the structures and functions of these complicated electro-mechanical systems. MEMS etching processes in particular, merit attention for material compatibilities because, of course, the function of etching is …

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MEMs process variables

Part 1: Getting a Handle on MEMS Process Variables

Fabricating MEMS devices presents unique challenges because of the three-dimensional (3D) and mechanical nature of the products. Specific mechanical structures are needed to perform the MEMS functions that involve vibration, rotation, or other types of motion (Figure 1). To accomplish …

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Single Wafer vs Batch Wafer Processing

In both semiconductor device and microelectromechanical systems (MEMS) manufacturing, wafer processes are generally divided into single wafer and batch processing. As the name implies, batch processing calls for multiple wafers to be processed at the same time. This cost-effective approach …

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As MEMS Hits Its Stride, memsstar Is Ready

Over the last few years, microelectromechanical systems (MEMS) have moved into the mainstream electronics markets as established technologies, and are experiencing additional growth through software and applications. Whereas 10 years ago MEMS discussions revolved around hammering out the processes, solving …

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