MEMS Tools

ORBIS™ ALPHA™
ORBIS™ 1000
ORBIS™ 3000

memsstar’s proprietary line of etch and deposition systems are designed to facilitate the successful transition to integrated dry MEMS processes for etch and deposition — from R&D to high yield manufacturing. Our expertise extends to the refurbishment of semiconductor etch and deposition platforms for use in MEMS manufacturing. Our comprehensive service offerings further support this effort.

memsstar is actively involved in all aspects of the MEMS industry and its development, including corporate membership of SEMI’s MEMS and Sensors Industry Group and representing SME’s on the Governing Board of the ENIAC Joint Undertaking European funding program

MEMS Technology Development

memsstar is a leader in MEMS process technology development, working independently and in conjunction with leading research organizations such as the Fraunhofer Institute, and commercial partners including Millipore Sigma.

One example of the company’s technology development is its use of amorphous silicon (a-Si) as a sacrificial layer in the construction of MEMS. Developed with the Fraunhofer Institute, the module enables the a-Si film to be deposited in a modified industry standard PECVD reactor as a sacrificial etch layer for subsequent isotropic release etching using the memsstar XERIC™ system. The module has fully characterized etch selectivity to many other materials, fast etch rates and excellent uniformity and repeatability. This integrated process sequence can be used within standard CMOS facilities or on top of CMOS wafers to enable many possible new applications.

Technology Integration and Fab-Compatible Platforms

memsstar’s unique patented processing system solution delivers unrivaled process control and wide process windows for vapor phase isotropic etch and surface modification.

memsstar ORBIS™ systems offering:

Manufacturing Systems

R&D Systems

XERIC™ Vapor Release Etching

Customers who use memsstar’s residue-free dry-release processing benefit from the company’s advanced vapor delivery, chamber technology, and sophisticated process monitoring.

Read more:
Vapor HF (Hydrogen Fluoride)
– Vapor Release Etching of Oxide

XeF2 (Xenon DiFlouride)
– Vapor Release Etching of Silicon

AURIX™ SAM Coatings

memsstar’s systems and MEMS process expertise include hydrophobic anti-stiction precursors, anti-wear coatings, hydrophilic treatments for anti-fouling, microfluidics and bio-inert implantable devices; and bio-active coatings. Self-assembled monolayers are produced in a two-stage process that combines plasma activation with surface deposition –- all precision controlled and monitored using innovative patented systems.

For more information on memsstar MEMS products and services or to find out how our MEMS process technology fits your company’s needs, please contact us.