MEMS Tools
memsstar is a leader in MEMS process technology development, actively involved in all aspects of the MEMS industry – both independently and as a partner for leading research institutes and commercial organisations. We are engaged with the Fraunhofer Institute and the Technical University of Munich’s Quantum Networks Lab.
memsstar’s proprietary line of etch and deposition systems is designed to facilitate the successful transition from R&D to high-yield manufacturing with integrated dry MEMS processes. Our expertise further extends to the refurbishment and comprehensive service of semiconductor etch and deposition platforms for use in MEMS manufacturing.
MEMS Technology Development
One example of our company’s technology development is the use of amorphous silicon (a-Si) as a sacrificial layer in MEMS fabrication. Developed with the Fraunhofer Institute using an Applied Materials (AMAT) system, refurbished by memsstar, the module enables deposition of an a-Si film in a modified industry-standard plasma-enhanced chemical vapour deposition (PECVD) reactor as a sacrificial etch layer for subsequent isotropic release etching. The module has fully characterised etch selectivity to many other materials, with fast etch rates and excellent uniformity and repeatability. This integrated process sequence can be used in standard CMOS facilities or on top of CMOS wafers, enabling many new applications.
Another example is the Walther-Meißner-Institute’s (WMI) implementation of our ORBIS Alpha XERICTM oxide etch system to facilitate micromechanical structuring of superconducting quantum circuits and components across single chips up to 200mm wafers. WMI is also employing our tool and processes to fabricate superconducting quantum circuits – in particular, qubits, the basic building blocks of quantum computers.
Seamless Technology Integration and Fab-Compatible Platforms
memsstar’s unique, patented solution leverages our memsstar ORBIS system to deliver unrivalled process control and wide process windows for both manufacturing and R&D environments.
Manufacturing
ORBIS 1000 – Single-wafer vacuum loadlock ideal for low-volume MEMS production environments with automated single-wafer handling; convertible to the fully automated ORBIS 3000.
ORBIS 3000 – Single-cassette cluster tool that provides automated wafer handling and process integration for volume MEMS manufacturing.
R&D
ORBIS ALPHA – Low-cost, small-footprint, self-contained etch development platform designed to meet the price and performance requirements of institutional and academic markets.
Leading Etch and Deposition Capabilities
Our advanced XERICTM and AURIXTM process modules process all standard sizes of substrates and can be modified and optimized for process-, substrate-, or design-specific parameters for advanced process control. Key benefits include faster process times; denser, more robust films; superior within-wafer uniformity; and optimal wafer-to-wafer repeatability.
XERICTM Vapor Release Etching
Our residue-free, dry-release XERICTM Vapor Release Etching provides customers with advanced vapour delivery, chamber technology, and sophisticated process monitoring.
Read more:
- Vapor HF (Hydrogen Fluoride)– Vapor Release Etching of Oxide
- XeF2 (Xenon DiFlouride) – Vapor Release Etching of Silicon
AURIXTM SAM Coatings
Our expertise includes hydrophobic anti-stiction precursors, anti-wear coatings, hydrophilic anti-fouling treatments, microfluidics and bio-inert implantable devices, and bio-active coatings. Self-assembled monolayers (SAM) are produced in a two-stage process that combines plasma activation with surface deposition.
