Dry Release Etching

XeF2 Etching Solutions from memsstar

memsstar’s XERIC™ dry release etch process module is available using vapor HF (Hydrogen Fluoride) and XeF₂ (Xenon DiFluoride) chemistries. Combined with the company’s AURIX™ surface modification process module, memsstar is a leader in providing industry-leading release etch and self-assembled monolayer solutions.

memsstar’s XERIC system offers solutions for commercial R&D through to full-scale high volume manufacturing, by integrating memsstar’s ORBIS™ platforms to achieve the latest and most advanced processing.

memsstar’s XERIC etch process module offers the strongest approach to effectively releasing MEMS structures from the sacrificial layer, while eliminating the problems associated with alternative approaches, including stiction, incompatible and poorly controlled wet chemistries, poor control and monitoring of stagnant gas systems, and multiplicity of unit process steps.

Sacrificial Vapor Release Etching

Dry release processing from memsstar using the XERIC process module benefits from our advanced vapor delivery and chamber technology, enabling stiction-free and residue-free dry processing coupled with sophisticated process control and monitoring.

Wet Etching Vs Dry Etching Processes for Current and Next Generation MEMS devices: This blog post describes some of the current methods for MEMS manufacturing from an etch perspective, from wet etching and its evolution to the current suite of dry release technologies. Read our post – Wet Etching Vs Dry Etching.

Dry Release Etching FAQs

1. What is dry release etching and why is it important for MEMS manufacturing?

Dry release etching is the process of removing the sacrificial layer to release a MEMS structure using a vapour-phase chemistry rather than a liquid one. memsstar’s XERIC™ dry release etch process module offers the strongest approach to effectively releasing MEMS structures from the sacrificial layer while eliminating the problems associated with alternative approaches – including stiction, incompatible and poorly controlled wet chemistries, poor control and monitoring of stagnant gas systems, and a multiplicity of unit process steps. By relying on advanced vapour delivery and chamber technology, XERIC enables stiction-free and residue-free dry processing with sophisticated process control and monitoring.

2. What chemistries does memsstar’s XERIC dry release etch process use?

memsstar’s XERIC dry release etch process module is available using two vapour-phase chemistries: vapour HF (hydrogen fluoride) and XeF₂ (xenon difluoride). Each is offered as a sacrificial vapour release etching solution, giving process engineers a dry-release option matched to their specific material set.

3. When should you choose HF versus XeF₂ for vapour release etching?

The right chemistry depends on the sacrificial material being removed. memsstar offers XERIC vapour HF for sacrificial vapour oxide release etching and XERIC XeF₂ for sacrificial vapour silicon release etching as two distinct paths. Because both are delivered on memsstar’s XERIC system with advanced vapour delivery and process monitoring, engineers can select the chemistry that best fits their materials and device architecture while retaining consistent, stiction-free, residue-free dry processing.

4. How does dry release etching compare with wet etching for MEMS devices?

Dry release etching addresses many of the limitations of traditional wet approaches, which can suffer from incompatible and poorly controlled wet chemistries. Using the ORBIS™ process module, memsstar delivers stiction-free, residue-free dry processing, coupled with sophisticated process control and monitoring, while avoiding the drawbacks of both wet chemistries and stagnant gas systems. memsstar also explores this topic in depth in its “Wet Etching vs. Dry Etching” blog post, which traces MEMS manufacturing from wet etching through today’s suite of dry release technologies.

5. Can memsstar’s XERIC dry release process scale from R&D to high-volume manufacturing?

Yes. XERIC offers solutions for commercial R&D through full-scale, high-volume manufacturing by integrating memsstar’s ORBIS platforms to enable the latest, most advanced processing. This gives customers a single, scalable technology path as they move from development to production. Combined with memsstar’s AURIX™ surface modification process module, ORBIS positions the company as an industry leader in release etch and self-assembled monolayer solutions.