01.10.2009
memsstar® Ships First System to China
02.06.2009
Amorphous Silicon Process Module Announced for MEMS
31.03.2009
Vapour HF System Released
25.09.2008
Fraunhofer Qualifies SVR Etch
26.05.2008
First Call for ENIAC proposals
30.03.2008
memsstar® enters Japan market with Canon MJ
08.10.2007
Full Range of Productivity Solutions released on memsstar platform
14.07.2007
SAFC Hitech and memsstar® announce Strategic Alliance
06.06.2007
Round A funding complete with Close Ventures
24.01.2007
SEMEFAB Selects memsstar® for Advanced MEMS Processing
02.01.2007
Oligon qualifies memsstar® for Advanced Release Etching on Latest MEMS Membranes
13.12.2006
Point 35 Microstructures Wins Prestigious NMI Award for Innovation
31.08.2006
MNT (Micro and Nano Technology) Project Awarded for Advanced MEMS Applications
10.07.2006
New CCFT announced at Semicon West
04.04.2006
memsstar® launch SVR and SPD modules at Semicon Europa
03.02.2006
1st memsstar® shipment to USA complete
06.10.2005
1st memsstar® Systems Signed Off By Customer
memsstar Technology joins MEMS Industry Group
10.06.2005
POINT 35 MICROSTRUCTURES COMPLETE BOARD RE-STRUCTURING
Dry Release Etching - vapour HF and XeF2 chemistries
Surface Modification - robust, ultra thin coatings
UNRIVALLED PROCESS CONTROL and INTEGRATION
Integration
A common technique used in semiconductor fabrication is the use of cluster tools ...
Surface Treatment
Surface Treatment encompasses some distinct surface engineering steps ...
Release
In MEMS processing the Release process is etched removal of the Sacrificial Materials ...
