Silicon and Oxide Etch Development Platform for Cost-effective MEMS Research

memsstar’s ORBIS ALPHA system is a low-cost, small footprint, self-contained version of our proven XERIC process. This allows for all the capability of memsstar’s unique patented high volume production process to enable researchers to develop production-capable processes for the next generation of MEMS devices.

The ORBIS ALPHA system is available as a silicon etch module utilizing xenon difluoride or as an oxide etch module utilizing hydrogen fluoride etchants.

ORBIS ALPHA Key Features
Key characteristics Large process window to optimize process for any structure
Excellent selectivity with silicon nitride and silicon dioxide (<5% 1σ)
High selectivity to underlayer and mechanical materials
Industry-leading etch rates
High etch rates for undercut and blanket Si
Excellent uniformity (<5% 1σ)
Excellent repeatability (<5% 1σ)
No corrosion
No stiction
In-line controls—etch rate monitor, endpoint, temperature
Unique endpoint capability
Self contained, on-board etchants (XeF2 or HF)
Handles materials from sample sizes to 200mm
Small footprint (600 x 540 x 900 mm)
DeviceNet control
LabVIEW control system
PC controlled
Resistive touch screen
Application examples Sensors, RF MEMS, micro bolometer arrays, accelerometers, RF switches, temperature gauges

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